LPKF Laser Direct Structuring System Speciality Products and

LPKF Laser Direct Structuring System Speciality Products and

LPKF Laser Direct Structuring System Speciality Products and Services Group Electrical functionalisation of non conductive 3D Structures Electrical tracks produced on 3D structures - allowing SMT assembly, die attach, wire bonding etc. Metallised Fingers for Robotic Hand LPKF Laser Direct Structuring of 3D devices.

LPKF Laser Direct Structuring System Tyndall Fabrication Process 3D Design and drawing. 3D part fabrication. Conductive layer design and drawing. Part Coating ProtoPaint epoxy layer. Laser Direct structuring as per design. Copper plating Post processing NiAu plating, Flip chip bonding, SMT, wire bonding LPKF Laser Direct Structuring System LPKF Laser Direct Structuring System

Fabrication Principle LPKF Laser Direct Structuring System 3D Design In-house 3D design of parts Autocad used to produce .step files which can be imported to LPKF system. Autocad used to produce .dwg files for fabrication in mechanical workshop. LPKF Laser Direct Structuring System 3D Part Fabrication In-house mechanical workshop fabrication from 3D designs. Parts fabricated from metals or plastic materials.

3D designs can be used to fabricate parts using standard 3D printers LPKF Laser Direct Structuring System Conductive layer design Autocad produces .stp files with both the 3D part and associated conductive layer. LPKF system used .stp file to laser write the conductive layer on a ProtoPaint epoxy layer which is applied to 3D part surface. LPKF Laser Direct Structuring System Part Coating ProtoPaint epoxy layer. Spray coating of 3D part

surface. Multiple layer build up to produce a smooth surface finish. Low temperature oven bake to cure epoxy. Coating on conductive and non conductive materials. Possible materials include LPKF Laser Direct Structuring System Laser Direct Structuring Laser writing LPKF system laser etches the conductor design in the top surface of the ProtoPaint epoxy. The laser removes some of the epoxy material exposing metal

particles in the ProtoPaint layer. These metal particles can act as a seed layer for deposition of Cu layer. LPKF Laser Direct Structuring System Laser Direct Structuring Protopaint Metal particles exposed by the laser Copper, palladium, Chromium and Magnesium Seed Layer LPKF Laser Direct Structuring System Copper plating Electroless copper plating of seed layer exposed by laser etching of the ProtoPaint top surface. Layer thickness is a timetemperature dependent build up of copper.

LPKF Laser Direct Structuring System Copper plating LPKF Laser Direct Structuring System Copper plating Test coupons used to check track resistance and isolation between tracks. Different track and gap widths were designed to look at the effect of this on electrical measurements. Typical track resistance of <1 ohm Typical isolation of > 2K ohm Part Type 200 m TG Plating

Thickness 9 m Track Resistance 0.8 0.8 200 m TG 9 m 0.9 1.0 500 m TG

5 m 0.8 1.0 500 m TG 9 m 0.5 0.5 100 m TG 6 m

0.5 0.6 Fingers Resistance Open Circuit >2000 Open Circuit >2000 Open Circuit >2000 Open Circuit >2000 Open Circuit >2000 LPKF Laser Direct Structuring System

Post Processing - Solder Copper plating provides a solderable finish Allowing post process SMT assembly, solder flip chip etc. Element ID SMT 1 SMT 2 SMT 3 SMT 4 size x size y (um) (um) 1200 500

1200 500 1200 500 1200 500 SIZE X (inch) 0.0472 0.0472 0.0472 0.0472 SIZE Y (inch) 0.0197 0.0197 0.0197 0.0197

Area 10-4 (inch square) 9.30 9.30 9.30 9.30 Solder ball Placement Mil-883-J Requirement (Kg) 0.37 0.37 0.37 0.37 Measured Shear

Force (Kg) 3.12 2.72 4.12 3.08 LPKF Laser Direct Structuring System Post Processing - Solder Solderable finish allows for in house Laser Assisted Solder Jetting (SB) LPKF Laser Direct Structuring System Post Processing - NiAu Plating

NiAu Plating on the copper surface Increased solderability Wire bondable finish Bond No. Streng th (gf) Military Standard (1) (2)

(3) (4) (5) (6) (7) (8) (9) (10) 5.35 6.45 8.30 4.55 5.90 5.65 9.10 4.95 5.15

6.20 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 3.00 (gf) LPKF Laser Direct Structuring System Post Processing - NiAu Plating

LPKF Laser Direct Structuring System Post Processing - NiAu Plating Assisted Solder Jetting (SB) LPKF Laser Direct Structuring System Demonstrator 1 Antenna on housing Antenna fabricated directly on surface of 3D printed component housing. LPKF Laser Direct Structuring System Demonstrator 2 Chemical Sensor PCB Equivalents

Flip chip over hole based micro electrode chemical sensor 3D substrate Demonstrator Silicon based Micro electrode arrays. Complete Design and Fabrication in Tyndall Machined plastic substrate Silicon Sensor die LPKF Laser Direct Structuring System Demonstrator 2 Chemical Sensor Electrodes Protopaint application Laser Patterning Machined plastic substrate Copper plating

Solder flip chip Underfill sealing of sensor LPKF Laser Direct Structuring System Contact Information Ken Rodgers Phone: +353 21 2346898 Email: [email protected] Finbarr Waldron Phone: +353 21 2346093 Email: [email protected]

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